http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 1 1. scope this specification shall cover the characteristics of the ceramic fliter with the type ltcv10.7ms2. th e ltca10.7ms2 filters are small, high performance and very thin (1.5 mm) chip devices consisting of 2 ceramic elements for communication equipment. they are designed on mgtio3 ceramic cap package. 2. part no.: part number customer part no specification no ltcv10.7ms2 3. outline drawing and dimensions: appearance: no visible damage and dirt. dimensions: according to figure 1. figure 1.
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 2 4. structure oscillation electrode cermic cover glue cermic substrate output/input electrode 5. electrical specifications: 6. measurement: measurement conditions: parts sha ll be measured under a condition ( temp. 2015 ,humidity 6520% r.h.) unless the standard condition(temp. 253 ,humidity 655% r.h.) is regulated to measure. test circuit: r2 s.s.g. rf voltmeter c2 rg no. items requirements center frequency(fo)(mhz) the center point of 3db band width is defined as the center frequency and identified by the letters:a,b,c,d or e. a:10.7000.030 b:10.6700.030 c:10.7300.030 d:10.6400.030 e:10.7600.030 5.2 3db bandwidth(khz) 230 50 5.3 20db bandwidth(khz) max 510 5.4 insertion loss (db) 3.5 2.0 (at minimum loss point) 5.5 ripple (db) max 1.0 (within 3db bandwidth) 5.6 spurious response (db) min 35 (9mhz-12mhz) 5.7 input/output impedance( ? ) 330 5.8 withstanding voltage 50v dc 1 min 5.9 insulation resistance (m ? ) min 100 (dc 10v) 5.10 operating temperature range( ) -25 +85 5.11 storage temperature range( ) -40 +85 r1=280 ? 5%,r2=330 ? 5%,rg=50 ? :input c2=10 pf (including stray capacitance :ground and capacitance of rf voltmeter) :output s.s.g:output voltmeter
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 3 7. physical and environmental characteristics no. item condition of test performance requirment 7.1 low temp stora g e stored in -40 3 for 96 hours an d left at room temp. for 1 hour before measurement. meet table 1 7.2 high temp storage stored in 85 2 for 96 hours and left at room temp. for 1 hour before measurement. meet table 1 7.3 humidity stored at 40 2 in 90 95%r.h. for 96 hours, and left at room temp. for 1 hour before measurement. meet table 1 7.4 thermal shock after temp. cycling of -40 (30 minutes) to +85 (30 minutes) was performed 5 times, filter shall be measured after being placed in natural condition for 1 hour . meet table 1 7.5 sol d ering test passed through the reflow oven under the following condition for 2 times, and left at room temp. for 24 hours before measurement. meet table 1 7.6 solderability dipped in 235 5 solder bath for 3 0.5 seconds with rosin flux. the terminals shall be at least 95% covered by solder temp. at the surface of the substrate time preheat 150 5 60 10 sec peak 235 5 10 3sec 7.7 drop test free drop to the wood plate from the height of 70 cm for 3 times. meet table 1 7.8 vibratio n apply the vibration of sweep frequency 10 to 55hz/minutes, amplitude 1.5mm, duration 2 hours in each direction of 3 planes. meet table 1 7.9 board bending mount on a glass-epoxy board( width=50 mm, thickness=1.6mm),then bend it to 1mm displacement(velocity 1mm/ sec) and keep it for 5 seconds. mechanical damage such as break shall not occur table 1 5 r 1 0 20 d.u.t press head support bar press 452 1.00.2 452
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 4 note: the limits in th e above table are refe renced to the initial measurements. 8. recommended land pattern and reflow soldering standard conditions recommended land pattern 2.90.3 2.90.3 4.00.3 1.50.3 1.50.3 1.50.3 recommended reflow soldering standard conditions pre-heating 220~230 100 150 200 within 10 sec within 20-40sec within 80-120sec. temperature() item specification insertion loss drift (db) max 2 3db bandwidth drift (khz) max 25 20db bandwidth drift (khz) max 60
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 5 9. package to protect the products in storage and transportation it is necessary to pack them outer and inner package .on paper pack, the following requirements are requested. dimensions and mark at the end of package, the warning (moisture proof, upward put) should be stick to it. dimensions and mark (see below) no. name quantity notes 1 package 1 2 certificate of approval 1 3 label 1 4 tying 2 5 adhesive tape 1.2m 6 belt 2.9m 7 inner box 10
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 6 section of package package is made of corruga ted paper with thickness of 0.8cm.package has 10 inner boxes, each box has 1 reels, every reel is vacuum packed for plastic bag (at 300 torr of vacuum rate). quantity of package per plastic reel 4000 pieces of piezoelectric ceramic part per inner box 1 reels per package 10 inner boxes 40000 pieces of piezoelectric ceramic part inner packing dimensions 1 label 2 qc label 3 inner box pars shall be packaged in box w ith hold down tape upside. part no., quantity and lot no. 1.unit: mm
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 7 reel (unit: mm) 120 16.4min 22.4max. 2.00.5 " ? " ? " ? taping dimensions tape characteristics feeding direction end blank pocket 10 pitches ...... loaded pocket blank pocket 10 pitches ...... 150~200mm lead tape 1.75 0.1 1.5 0 8.0 0.1 +0.1 chip filter 1.5 0 4.0 0.1 2.0 0.1 7.5 0.1 3.5 0.1 (unit:mm) 16.0 0.2 7.5 0.1
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 8 test condition of peeling strength p e e l i n g s t r e n g t h 2 0 - 7 0 g carrier tape top tape 10 max 10 other 10.1 caution of use 10.1.1 do not use this product w ith bend. please don?t apply excess mechanical stress to the compone nt and terminals at soldering. 10.1.2 the component may be damage d when an excess stress will be applied. 10.1.3 conformal coating of the component is acceptable, however the resin materials ,curing temperature and other process conditions should be evaluated to conform stable electr ical characteristics are maintained. 10.2 notice 10.2.1 this specification mentions th e quality of the component as a single unit. please insure the compone nt is thoroughly evaluated in your application circuit. 10.2.2 please return one of this specification after your signature of acceptance. 10.2.3 when something gets doubtful with this specifications, we shall jointly work to get an agreement.
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